• No-Pb and SnPb solder assembly and reliability
• Forward and backward compatible (no-Pb/SnPb) assembly and reliability
• Conductive adhesive assembly and reliability
• PCB robustness and reliability in no-Pb and SnPb assembly.
• PCB materials and design data base
• Thermal cycling test parameters and life assessment
• Mechanical test (drop, bending, vibration...) protocols and interpretation
• Solder pad finish issues (Cu, imm. Ag, imm. Sn, ENIG, Ni/Au, HASL), 'black pad’, ‘missing balls’, Kirkendall voiding, ‘champagne voids’ ...
• Flip chip, WL-CSP, QFN, LGA, CSP, BGA... assembly and reliability
• Lead free metallurgy and reliability (SnAg3.5Cu1.0, SnAg4.0Cu0.5, SnAg3.8Cu0.7, SnAg3.0Cu0.5, SnAg2.2Cu0.7, SAC(Ni), SAC(Co), SAC(Fe), SAC(Zn),.....)
• Repair
• Component underfilling
• Stencil printing
• Assembly yield modeling software
• Die cracking