PbSn or lead free (RoHS compliant) soldering and reliability? Forward/backward compatibility? PCB design, materials, reliability? Mini-BGA/CSP, package-on-package, flip chip, pin-in-paste, SMT? Adhesive based assembly? ....
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Research: With broad experience from across the industry and advanced degrees in chemistry, physics, materials science, mechanical engineering, industrial engineering, electrical engineering, chemical engineering, and ceramics our topic experts and scientists will research almost any topic to any depth you want. Research projects can be proprietary to you, or you can share the cost with members of our Consortium.
Prototyping: Using specialized equipment or our full scale manufacturing lines we have prototyped flip chip BGAs and CSPs, pacemakers, a catheter, industrial control systems, an insulin injection syringe, a phase array radar detector system, a gamma ray/X-ray detector system, CT scanner subsystems, cell phones, a Bluetooth module, disc drives and More...
Repair: LGA, BGA and CSP rework requires a skilled operator and specialized equipment. New component types require process development and validation. Lead free solder raises risk of component or PCB damage. We'll develop the processes or repair your assemblies for you. More...
Part Authentication: Lots of people must resort to non-franchised brokers right now. We'll sample your incoming lots to ensure it's not an inferior knock-off or repaired/reballed original.
Design and Design Validation: Our design for manufacturability and reliability services relate not only to the assembly process but also to the PCB manufacturing step! More...
Materials Selection and Testing: Laminates, solder masks, inks, adhesives, fluxes, solders, underfills, ... must perform, survive and be mutually compatible. RoHS and WEEE have led to serious new demands on materials. Many new lead free compliant and/or halogen free materials have hidden weaknesses. More...
Process Development on Production-Scale Equipment: Integrated processes for automated manufacturing are developed on one of our full scale assembly lines (equipment).
Transfer to Manufacturing: We provide for seamless transfer of the processes to your facility or the CEM of your choice. More...
Training and Ongoing Support: Transfer includes training of your/their staff in our lab and if necessary at their place. Direct contacts are established for follow-up questions and ongoing support afterwards. More...
Process Audits: Is there room for improvement of your quality, yields, or throughput? You may be surprised. More...
Mechanism Based Reliability Testing: More and more often 'standard' tests and protocols prove outdated or insufficient. We test 'to spec' when required, but we can help you address actual reliability concerns, accounting for competing and synergistic damage mechanisms as well as the fundamentally different properties of lead free solders. More...
Root Cause Failure Analysis and Remediation: Failure modes and mechanisms. Effects of defects, design and materials deficiencies, process problems, overstress, thermal cycling, mechanical shock and fatigue, ambient exposure, degradation, incompatibilities, and more...... If we don't understand it and know how to prevent it, we are researching it.
RoHS & WEEE Compliance: Are you exempt? If this link doesn’t help (click here) we can connect you with someone who can. Need to modify or change materials or processes to be compliant? We can help with that, questions of materials compatibilities and assembly reliability, and so on.
Conflict Resolution: What was the problem? Component, PCB, metallization, materials, assembly, subsequent handling, or some other factor? Our independent assessment and documentation usually resolves it, but we'll testify in court if needed.
Cost: Call George Westby (607-779-5258) or email him at westby@uic.com to outline your needs and get a quick estimate of the cost, or to get a formal quote.