PbSn or lead free (RoHS compliant) soldering and reliability? Forward/backward compatibility? PCB design, materials, reliability? Mini-BGA/CSP, package-on-package, flip chip, pin-in-paste, SMT? Adhesive based assembly?

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Contact George Westby (westby@uic.com, (607) 779 7522)

Capabilities: Click to view our complete production scale assembly facility, or our comprehensive analytical and test capabilities.

Services: Prototyping, part authentication, design and design validation, materials selection and testing, process development on production scale equipment, transfer to manufacturing, training and ongoing support, process audits, mechanistic based reliability testing, root cause failure analysis and remediation, RoHS & WEEE compliance issues, conflict resolution, and more... Click for details or examples.

Research: Proprietary research projects of individual customers. Or share research cost by joining our consortium. More...

Problem? Are you an expert yourself? Are you totally out of your depth and need someone to take ownership? We can work with you either way. Come to us at any stage along the way. Come when something went wrong and you want to know why, or what to do about it. A growing number of customers come ahead of time, to prevent it from going wrong.

We join your team when you need us: It's like outsourcing -- you get all the flexibility and only pay for what you need. But it's also like having all the expertise you need in house. Our topic experts and scientists work with you to define what needs to be done. Often you'll find this is somewhat different from what you thought (more).

Our Team: 75% of our staff has advanced degrees (M.S. or Ph.D.) in chemistry, physics, materials science, mechanical engineering, industrial engineering, electrical engineering, chemical engineering, or ceramics. (Meet the team)

Cost: Call George Westby (607-779-5258) or email him at westby@uic.com to outline your needs and get either a quick estimate of the cost or a formal quotation.